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At Computex 2026, Wiwynn showcased a next-generation 800V DC power solution for data centers, addressing the rising power density demands of new AI accelerators. The demonstration, held at the Wiwynn booth, featured a server mock-up with dummy next-generation accelerator modules and highlighted a key partnership with TE Connectivity. The centerpiece was the TE Connectivity HVDC IT GEAR TO ELCON MICRO+ Power Cable Assembly, which connects an 800V/75A high-voltage DC (HVDC) input to a 400V Elcon Micro+ internal server power distribution. The move to 800V DC is driven by the industry’s transition to more powerful AI hardware, requiring higher efficiency and thermal management. In addition to higher voltage, the system employs a liquid-cooled busbar and internal liquid cooling blocks to manage heat. The server mock-up also featured a liquid-cooling nozzle, connectors for in-rack scale-up networking, and a busbar connector at the rear. To improve manufacturability, the entire power cable assembly is designed for drop-in installation during robotic assembly, rather than manual assembly on the production line. Wiwynn’s exhibit included an OCP-style front with a management module, four E1.S SSDs, and dummy optical network cages. The rear showed new liquid cooling infrastructure and the busbar connector that initiates the power chain. The demonstration served as an informative directional preview of how next-generation data center servers will handle significantly higher power loads through 800V DC distribution and integrated liquid cooling. This technology is expected to become critical as AI accelerator power requirements continue to escalate.