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Silicon Motion Announces Closing of Upsized Offering of $1,150,000,000 of 0.00% Convertible Senior Notes due 2031
Terrapinn’s acquisition of the Future Memory and Storage (FMS) event delivered a refreshed edition with over 4,000 attendees, a redesigned visual identity, and a conference program dominated by the AI-driven “Memory Wall” challenge, alongside major product launches from Kioxia, Samsung, Micron, Sandisk, and SK hynix. The event team preserved the strong expo floor and rich conference agenda while introducing improvements. Notable exhibitor absences included Nvidia (which still keynoted), Phison, Swissbit, and Panmnesia; newcomers like Primemas joined returning names such as ScaleFlux, Winbond, and YMTC. Five core themes emerged: AI inference and the evolving memory/storage hierarchy; new NAND technologies (BiCS10, V-NAND, XL-Flash, HBF); PCIe Gen 5 and Gen 6 connectivity; CXL 3.2 memory pooling and sharing; and energy consumption/cooling. Key announcements: Kioxia unveiled the CM10 Series, the first PCIe Gen 6 enterprise SSD built on 332-layer BiCS FLASH Generation 10 TLC, plus GP1 ultra-high-IOPS SSDs and next-gen E1.S drives. Samsung outlined its 3D Memory vision for AI infrastructure and displayed 256TB BM1773 SSDs (E3.S/U.2), PM1763, V-NAND V10, HBM4, and CXL modules. Micron demonstrated with Astera Labs and Microchip. Sandisk showcased HBF, BiCS10 NAND, and an UltraQLC E3.S 256TB prototype; with SK hynix, it released the first OCP Technical Specification for High Bandwidth Flash standardization. SK hynix highlighted HBM, NAND, SSDs, and CXL memory. Silicon Motion introduced the MonTitan SSD Reference Design Kit for AI and agentic AI storage. FADU,