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ASIC-to-FPGA Turnkey Prototyping Bundle: A Practical Path to Earlier Hardware Validation
FMS 2026 (Future of Memory and Storage), the premier enterprise infrastructure event for semiconductor, AI chip, memory, SSD, and data center professionals, will showcase near-term hardware developments addressing generative AI bottlenecks, with keynotes from Kioxia, Nvidia, Samsung, SK hynix, and Micron at the Santa Clara Convention Center from August 4–6, 2026. The conference focuses on practical, deployable technologies rather than distant roadmaps. Compute Express Link (CXL) memory pooling and fabric architectures take center stage as they move from testing to enterprise deployment. High-Bandwidth Memory (HBM), high-density NAND, next-gen enterprise SSDs, and advanced DRAM solutions are critical for scaling AI pipelines. Technical sessions also address thermal and power challenges, including liquid cooling for high-performance SSDs, energy-efficient storage configurations, and advanced telemetry. Keynote highlights: Kioxia America and Nvidia open the event, with Neville Ichhaporia (Kioxia SSD GM), Katsuki Matsudera (Kioxia Memory Marketing GM), and Jason Hardy (Nvidia Storage VP) detailing AI-era data center storage. Samsung’s Taeksang Song (DRAM VP) and Jin-yub Lee (Flash EVP) discuss DRAM and flash innovations. SK hynix’s Chunsung Kim (Solution Development EVP) and Uksong Kang (Next Gen Product Planning VP) cover tiered memory for agentic AI. FADU President Jihyo Lee and Sandisk Distinguished Engineer Ross Stenfort present hyperscale efficiency visions. Micron’s Jeremy Werner (Core Data Center SVP) breaks down AI memory management in the inference era. Additional sessions feature Neo Semiconductor CEO Andy Hsu on new AI memory architectures and Longsys Chief Scientific Officer Jian Chen on edge intelligence. Registration is open; SemiWiki readers get 15% off with code SEMIWIKI.