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At Qualcomm Investor Day 2026 in New York City, CEO Christiano Amon outlined the company's data center strategy, emphasizing rack-scale infrastructure, custom silicon, AI accelerators, and connectivity. Qualcomm announced the acquisition of Modular to bolster its AI software stack, aiming to compete with CUDA. The company unveiled High Bandwidth Compute (HBC), which stacks memory directly on compute tiles to eliminate interposer power loss, promising superior performance per watt. HBC will debut with the AI250 generation in 2027, with Gen2 integrating fabrics like UALink. Qualcomm also introduced the Dragonfly C1000 CPU, a chiplet design with over 250 cores, PCIe Gen7, CXL, LPDDR memory, optional HBC attach, and enterprise RAS features. The company claims 2x better performance per watt than competitors at 5GHz clock speeds. Key partnerships were highlighted: Microsoft CEO Satya Nadella discussed collaboration across PCs and AI agents, and Meta CEO Mark Zuckerberg announced a multi-generational agreement to use Qualcomm processors for AI. Humain CEO Tareq Amin also reaffirmed their long-standing partnership. Qualcomm's connectivity portfolio expands via the Alphawave acquisition, targeting hyperscalers with die-to-die, co-packaged optics, and PAM4/coherent optical technologies. The company positions custom silicon as a $115B TAM opportunity and updated its FY29 financial forecasts upward. Additionally, an Arduino Ventuno Q board featuring Qualcomm's Dragonwing IQ-8275 (40 TOPS) will be available later this summer. Qualcomm stressed it is not late to the data center, claiming multi-generational wins and hyperscale engagements across CPU, AI accelerators, custom silicon, and connectivity product lines.